高速pcb设计之布局检查
1.import idf (emn file)部份:
good no good check item 问题点说明
[ ] [ ] 1.01 确认无遗漏相关零件.
2. keepin / keepout 部份:
good no good check item 问题点说明
[ ] [ ] 2.01 确认package keepin.
[ ] [ ] 2.02 确认cpu keepout.
[ ] [ ] 2.03 确认bga keepout.
[ ] [ ] 2.04 确认fan keepout.
good no good check item 问题点说明
[ ] [ ] 2.05 确认heat sink keepout.
[ ] [ ] 2.06 确认simm / dimm / rimm socket keepout.
[ ] [ ] 2.07 确认daughter card keepout.
[ ] [ ] 2.08 确认mechanical keepout.
3. component 部份:
good no good check item 问题点说明
[ ] [ ] 3.01 确认螺丝孔是否正确.
[ ] [ ] 3.02 确认slot 零件座标是否正确.
[ ] [ ] 3.03 确认i/o port零件座标是否正确.
[ ] [ ] 3.04 确认socket zif 拉杆是否顺畅.
[ ] [ ] 3.05 确认dimm socket组件高度是否会卡件.
[ ] [ ] 3.06 确认零件摆放是否符合机构设计.
[ ] [ ] 3.07 确认key-components 设定fixed.
good no good check item 问题点说明
[ ] [ ] 3.08 确认critical component摆放位置正确.
[ ] [ ] 3.09 确认by-pass capacitor摆放位置正确, chipset 附近每边至少一个bypass cap.
[ ] [ ] 3.10 确认spacing between components恰当.
[ ] [ ] 3.11 确认重量较重之零件是否尽可能已摆放於后制之层面.
(避免第二次过高温炉掉件问题)
[ ] [ ] 3.12 确认un-placed component = 0.
[ ] [ ] 3.13 确认 components placement drc = 0.