Layered

The key signal layer should be temporary and tightly coupled to PCB can be reduced to reduce common-mode impedance, EMI

The key signal should go inside and in between (shield) of main power supply and should be tightly coupled

2 layout

PCB size (4/3 or 3/2) digital circuit, analog circuit and power circuit are respectively placed high frequency / low frequency separated interface, high, medium and low speed logic circuit

Signal line of the cloth in the outer convenient debugging, the impedance of power and ground cloth can reduce the power supply line in the inner

The 3 wiring

The line should be short, thick, uniform, loop to small pressure difference is large, the distance is far more power and ground should be wide and parallel key lines close to the reference to high speed close to the ground plane, low-speed element near the power plane

The 4 ground

Low-frequency single-point grounding, multi-point grounding number frequency, mode.

Three: process requirements

1 AI

Cannot AI- edge ≥ 5mm positioning hole 15mm within the AI element AI pitch is greater than or equal to 5mm

AI PAD-PAD ≥ 2.5mm AI PAD- another body is greater than or equal to 2mm

A foreign body AI body length = pitch -2.7mm not AI PAD compass direction 3mm

2 RH

RH- edge ≥ 5mm (SMD when dispensing ≥ 7.5mm) RH element pitch for 2.5mm/5mm

RH PAD-PAD ≥ 3.5mm AI-RH left / angle (90 ° /180 °) or right / down (0 ° /270 °)

3 SMD

SMD- edge ≥ 5mm (a board edge ≥ 3mm) 0402 for solder paste process dispensing process at least 0603

MARK plus point lower left (1mm and 3mm Square) right (1.5mm square and 3mm Square)

Can't MARK in 2mm line MARK- positioning hole PLCC PAD-PAD ≥ 3mm ≥ 5mm

The SMD element and the large copper foil connected application line even no angle restrictions

4 plug-in

Hand components - edge is greater than or equal to 3mm

5 ICT

ICT 0.4mm there shall be no foreign body around ICT centre -ICT centre ICT TEST PAD diameter ≥ 2.54mm ≥ 1.1 mm against a positioning hole to stay

6 general requirements

PAD- edge ≥ 3mm line / copper - plate with PAD-PAD ≥ 0.5mm ≥ 1mm network

Different network PAD-PAD ≥ 1mm ≥ 1mm Ontology - body horizontal resistance / jumper / relay /CPU/EC capacitor / radiating piece of /CHOCK/AI/RH/SMD, too low to be via, to prevent short circuits or on the tin side 0.4 via 2A 0.8 via 3.5A current through the current hole - hole is more than or equal to 1.2mm

The single panel aperture = element foot diameter +0.2mm (single) and /0.3mm (dual) hole - edge is greater than or equal to 1.6mm

The AI element aperture = element foot diameter +0.4mm (single) and /0.5mm (dual) pad diameter ≥ aperture +1.2mm/1.0mm (high density)

MASK than pad 0.2mm

7 PCB length / width size limit

AI process: MIN 50mm*50mm MAX 508mm*381mm

Solder paste process: MIN 80mm*50mm MAX 460mm*460mm

CM202 placement machine size: MIN 50mm*50mm MAX 460mm*360mm

Apply glue machine PCB size: MIN 50mm*50mm MAX 510mm*460mm

Aluminum frame: MAX 520mm*285mm (large aluminum frame)

MAX 450mm*285mm (small aluminum frame)

ICT: MAX 450mm*300mm*90mmm